Measurement of Thermally Induced Warpage of BGA
Packages/Substrates Using Phase-Stepping Shadow Moiré
Application of Digital Phase-shift Shadow Moiré to Micro
deformation measurements of curved surfaces
Vibration Analysis of Wiresaw Manufacturing Processes
and Wafer Surface Measurements
Optical Surveying and Mapping in Experimental Hydraulics
Shadow moire analysis of surface oscillations of the fluid
Analysis of combined moire and laser speckle grating methods
used in 3-D crack tip deformation measurements
Moiré and Fringe Projection Techniques
Measurement of Thermally Induced Warpage of BGA
Packages/Substrates Using Phase-Stepping Shadow Moiré
